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2003


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Investigation of Electromigration in Copper Interconnects by Noise Measurements

Emelianov, V., Ganesan, G., Puzic, A., Schulz, S., Eizenberg, M., Habermeier, H., Stoll, H.

In Noise as a Tool for Studying Materials, pages: 271-281, Proceedings of SPIE, Santa Fe, New Mexico, 2003 (inproceedings)

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[BibTex]

2003


[BibTex]