@inproceedings{escidoc:0800, title = {{Investigation of Electromigration in Copper Interconnects by Noise Measurements}}, author = {Emelianov, V. and Ganesan, G. and Puzic, A. and Schulz, S. and Eizenberg, M. and Habermeier, H.-U. and Stoll, H.}, booktitle = {{Noise as a Tool for Studying Materials}}, pages = {271--281}, series = {{Proceedings of SPIE}}, address = {Santa Fe, New Mexico}, year = {2003}, doi = {} }