Transfer Printing of Metallic Microstructures on Adhesion-Promoting Hydrogel Substrates
2015
Article
pi
Fabrication schemes that integrate inorganic microstructures with hydrogel substrates are essential for advancing flexible electronics. A transfer printing process that is made possible through the design and synthesis of adhesion-promoting hydrogels as target substrates is reported. This fabrication technique may advance ultracompliant electronics by melding microfabricated structures with swollen hydrogel substrates.
Author(s): | Wu, Haosheng and Sariola, Veikko and Zhu, Congcong and Zhao, Jingsi and Sitti, Metin and Bettinger, Christopher J |
Journal: | Advanced Materials |
Volume: | 27 |
Number (issue): | 22 |
Pages: | 3398--3404 |
Year: | 2015 |
Month: | April |
Day: | 22 |
Department(s): | Physische Intelligenz |
Bibtex Type: | Article (article) |
DOI: | 10.1002/adma.201500954 |
BibTex @article{wu2015transfer, title = {Transfer Printing of Metallic Microstructures on Adhesion-Promoting Hydrogel Substrates}, author = {Wu, Haosheng and Sariola, Veikko and Zhu, Congcong and Zhao, Jingsi and Sitti, Metin and Bettinger, Christopher J}, journal = {Advanced Materials}, volume = {27}, number = {22}, pages = {3398--3404}, month = apr, year = {2015}, doi = {10.1002/adma.201500954}, month_numeric = {4} } |