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Investigation of Electromigration in Copper Interconnects by Noise Measurements

2003

Conference Paper

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Author(s): Emelianov, V. and Ganesan, G. and Puzic, A. and Schulz, S. and Eizenberg, M. and Habermeier, H.-U. and Stoll, H.
Book Title: Noise as a Tool for Studying Materials
Pages: 271--281
Year: 2003
Series: {Proceedings of SPIE}

Department(s): Modern Magnetic Systems
Bibtex Type: Conference Paper (inproceedings)

Address: Santa Fe, New Mexico
Language: eng

BibTex

@inproceedings{escidoc:0800,
  title = {{Investigation of Electromigration in Copper Interconnects by Noise Measurements}},
  author = {Emelianov, V. and Ganesan, G. and Puzic, A. and Schulz, S. and Eizenberg, M. and Habermeier, H.-U. and Stoll, H.},
  booktitle = {{Noise as a Tool for Studying Materials}},
  pages = {271--281},
  series = {{Proceedings of SPIE}},
  address = {Santa Fe, New Mexico},
  year = {2003}
}